منابع مشابه
Development of Ultrasonic Flip Chip Bonding Technology
Millimeter wave radars have been developed and marketed for the purpose of reduction in deaths in traffic accidents and traffic congestion. However, the millimeter wave radars need to be cheaper to be used more widely. In order to make the radars cheaper, we developed a new MMIC (Monolithic Microwave IC) structure and bonding technology, focusing on reducing costs of RF-modules. This article de...
متن کاملBonding and Failure Behaviors of ACA Flip Chip Bumps
An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC)...
متن کاملFlip chip electrical interconnection by selective electroplating and bonding
This work presents a parallel electrical interconnection process by means of flip-chip, selective electroplating and bonding. The electrical interconnection lines are built on a glass substrate made of 500/2000 Å of Cr/Au with 3150 lm in length and 10 lm in width. Two silicon chips are processed as the device chips to be electrically interconnected. It has been demonstrated that 98 out of 102 i...
متن کاملFlip-chip Integrated Soi-cmos-mems Fabrication Technology
A fully-dry, flip-chip fabrication technology was developed for the integration of high fill factor, silicon-on-insulator (SOI) structures and CMOS-MEMS actuators. An SOI mirror array with a fill factor of 95% and radius of curvature >1.3 m was fabricated on CMOS-MEMS electrothermal actuators using this technology. The unloaded actuators achieved an optical scan range of >92o. Following flip-ch...
متن کاملDevelopment of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs). GGI is a lead free process where the Au bumps and Au bond pads are joined together by heat and ultrasonic power under a pressure head.
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2017
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/260/1/012005